Jiake NTC Finishing Line with CCD Inspection and Auto Cleaning

Project scope

The Jiake proposal describes an NTC finishing line that covers boarding, welding, automatic tinning, CCD inspection, automatic cleaning, encapsulation, shell insertion, resistance and hipot testing, and downstream manual finishing.

Process positioning

Compared with simpler NTC lines, this source adds explicit inspection and cleaning stations between the joining and encapsulation stages. The design is therefore focused on both throughput and tighter process control.

Mixed process stack

This line has to coordinate more distinct steps than the basic finishing proposals: boarding, welding, tinning, CCD-based weld checking, automatic cleaning, encapsulation, shell insertion, resistance testing, hipot testing and later manual assembly tasks.

Compatibility and quality limits

The source states compatibility with 24# and 26# twin wire and gives detailed material and dimensional requirements such as cut length range, strip length tolerance, board dimensions and board loading quantity. It also targets an overall defect rate below 0.5 percent.

Inspection after joining

The CCD section is used to detect weld-offset conditions after tinning and joining. That adds an inspection gate specifically intended to prevent poor alignment from flowing into encapsulation and later-stage operations.

Front-end configuration

The proposal sizes the boarding machine at about 2,000 pieces per hour and the welding and tinning sections at roughly 1,800 to 2,000 pieces per hour. It also gives detailed wire, strip and board parameter requirements for stable operation.

CCD and auto-cleaning sequence

After joining, the line inserts CCD inspection and an automatic cleaning machine. The source explicitly treats this as a dedicated segment rather than a manual cleanup task, which helps standardize visual and solder-quality control before encapsulation.

Downstream finishing

The later process includes automatic encapsulation, shell insertion and dispensing, manual supplemental glue after bake, automatic resistance and hipot testing, and manual sleeve cutting, terminal insertion and plastic-seat work. The plan also quantifies board counts and capacity for a 20,000-piece daily target.

Proposed operating result

The resulting line concept is more quality-controlled than the simpler NTC flows because it adds inline inspection and cleaning before encapsulation. The source positions it as a complete finishing route rather than only a set of machines.

Capacity and control value

The proposal is designed around a 20,000-piece daily target and adds structured quality controls such as CCD offset inspection, explicit dimensional requirements and automated resistance and high-voltage verification. That combination is intended to improve process consistency without removing every manual step.